BCM63153B1UKFSBG
![Qualität [#varpname#] usine](http://www.passive-electronicparts.com/images/load_icon.gif){kind=icon}
fabricant:
Broadcom begrenzt
Beschreibung:
212, BONDED, V/ADSL, 10G GW,NO VOIP/SPU
Kategorie:
Elektronische Halbleiter
Spezifikationen
Package ::
BGA
Packaging ::
Tray
Product Category ::
RF System on a Chip - SoC
RoHS ::
Green available
Manufacturer ::
Broadcom Limited
Einleitung
The BCM63153B1UKFSBG,from Broadcom Limited,is RF System on a Chip - SoC.what we offer have competitive price in the global market,which are in original and new parts.If you would like to know more about the products or apply a lower price, please contact us through the “online chat” or send a quote to us!
Senden Sie RFQ
Auf Lager:
MOQ: